Dielectric materials store energy in electrostatic form and are ubiquitous in a variety of advanced electronic devices and power systems. The most classic example is the ceramic dielectric materials. However, polymer dielectric materials have received increasing attention in recent years because of their higher breakdown strength and better reliability, and are lightweight and can be easily formed into complex structures. However, polymer dielectric materials also have their own troubles, that is, the operating temperature is relatively low so they cannot work in extreme environments, such as automotive engines,special power electronics and so on.
Recently, researchers from the University of Pennsylvania have invented a new type of high temperature resistant flexible polymer nanocomposite dielectric material that brings the dawn of polymer dielectric materials in high-temperature environments. This new material includes cross-linked polymers and boron nitride nanosheets. The presence of boron nitride nanosheets greatly enhances the thermal conductivity of this material, which accelerates heat dissipation and improves the material's high-temperature resistance.
Related tests have shown that the material's energy storage density is increased by a factor of 4 compared to conventional materials (which means that capacitors of the same capacity will become lighter and smaller), which will remain stable at temperatures up to 300 °C. And can withstand multiple bending folds.
Although the production cost of such high temperature resistant flexible polymer dielectric materials may be higher than conventional materials, and long-term wear resistance and tear resistance have yet to be verified, researchers are convinced that this new material will have extremely bright application prospects.
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